Inorganic high-temperature adhesives are usually used in the range of 1500 to 1750 °C, while phosphate copper oxide adhesives have a wider temperature resistance range and can be used in the range of 180 to 1400 °C. However, the main aggregates used in inorganic high-temperature adhesives are zircon sand and refractory soil. Zircon sand is expensive and mainly imported. Refractory and soil must be obtained at the expense of land, which is costly. Therefore, it is imperative to find cheap and easily available products to replace traditional aggregates to reduce production costs. Some organic adhesives have also achieved high temperature resistance through modification. For example, a phenolic resin modified with B4C can withstand a high temperature of 1500 °C.
The market demand for temperature-resistant adhesives is growing, so this type of adhesive has broad development prospects. 2. Low pollution With the deterioration of the global environment, people gradually began to use some environmentally friendly products. Although adhesives are not a huge chemical product, their harm to the environment cannot be ignored. Those non-environmentally friendly adhesives will gradually be discarded. Polyvinyl formaldehyde adhesive (commonly known as "107 glue") is harmful to human health because it contains free formaldehyde. It has long been banned in developed countries, but in my country, due to its low price, it still has a considerable market share. However, its usage has been gradually reduced and will soon be completely phased out. How to make non-environmentally friendly adhesives into environmentally friendly adhesives through modification is an imperative work. 3. The connection of bonding non-destructive materials mainly includes bolt connection, riveting, welding and bonding, etc. Although fast connection can be achieved by using bolt connection and other technologies, the material is affected by hollowing out or local heating of material parts. damage, and stress concentration cannot be avoided in use.
In contrast, bonding technology is a non-destructive joining technique and increases the load capacity due to the overall load-bearing of the bonding interface, extending the service life. 4 The density of lightweight adhesives is small, mostly between 0.9 and 2, which is about 20% to 25% of the density of metal or inorganic materials, so it can greatly reduce the weight of the connecting material of the adhered object. This has the important value of reducing self-weight and saving energy in aerospace, aviation, missiles, and even automobiles and navigation.
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